KING OF PRUSSIA, Pa.—(BUSINESS WIRE)—Oct. 7, 2005—
InterDigital Communications Corporation (Nasdaq:IDCC)
today announced the availability of its UMTS Release 5 HSDPA (High
Speed Downlink Packet Access) coprocessor terminal unit ASIC
(Application Specific Integrated Circuit) in accordance with its
announced schedule. InterDigital's HSDPA technology, verified now in
ASIC form, optimally supports all service categories up to Category 10
(14 Mbps) for incorporation into mobile terminal devices.
Fabricated using 130 nanometer technology and designed to be
process independent, InterDigital's HSDPA coprocessor includes the
following features:
-- Compliance with UMTS Release 5;
-- Low power consumption;
-- Low MIPS requirements;
-- Low-profile package (8 x 8mm with 132 pin Ball Grid Array);
-- Flexible design allows for customized OEM implementation;
-- Optimally supports all categories;
-- Design can be scaled to customer targeted categories;
-- Easy integration with existing UMTS Release 99/Release 4
implementations.
-- Supports transmit and receive diversity;
-- Already meets stricter UMTS Release 6 requirements;
-- Architecture scalable to Release 6 HSUPA (High Speed Uplink
Packet Access).
InterDigital offers its standards-compliant HSDPA technology
solution as a separate coprocessor which can be adapted to interface
with any UMTS Release 99/Release 4 offering. InterDigital's solution
can also be provided to a customer as technology blocks for
incorporation into existing UMTS Release 99/Release 4 chips.
InterDigital recently announced Philips Semiconductor, NV as its first
HSDPA technology customer.
InterDigital's HSDPA coprocessor incorporates an advanced receiver
(chip level equalizer) which is the key enabler in achieving high data
rate performance and meeting the stricter performance levels for UMTS
Release 6.
HSDPA technology provides wireless equipment producers and
semiconductor suppliers with the next step in the evolution of their
3G UMTS terminal products. HSDPA allows operators to increase network
capacity, lower their cost per bit and provide mobile users with
improved access to the Internet and enhanced download capability for
email, music and video content.
"At 3GSM World Congress earlier this year, we demonstrated our
advanced receiver-based HSDPA solution in an FPGA form," said Mark
Lemmo, Senior Business Development and Product Management Officer.
"The implementation of HSDPA as a coprocessor validates our market
leadership in the delivery of advanced 3G technologies. Our mature,
scalable HSDPA solution complements our UMTS Release 99/Release 5
protocol software solution and provides a migration path to HSUPA."
To learn more about InterDigital's technology and product solution
offerings, contact sales@interdigital.com.
About InterDigital
InterDigital designs, develops and provides advanced wireless
technologies and products that drive voice and data communications.
The company offers technology and product solutions for wireless
applications that deliver time-to-market and cost advantages, as well
as performance improvements and product differentiation opportunities
for its customers. InterDigital has a strong portfolio of patented
technologies covering 2G, 2.5G, 3G and 802 standards, which it
licenses worldwide. For more information, please visit InterDigital's
web site: www.interdigital.com. InterDigital is a registered trademark
of InterDigital Communications Corporation. All other trademarks are
the property of their respective owners.
Contact:
InterDigital Communications Corporation
Media Contact:
Dawn Goldstein, 610-878-7800
Email Contact
or
Investor Contact:
Janet Point, 610-878-7800
Email Contact
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